: Products with Xilinx FPGA

TE0723 ArduZynq Series｜Xilinx Zynq-7000

TE0723 ArduZynq Series-Xilinx Zynq-7000, Form Factor like Arduino Shield, DDR3L, Flash, USB OTG(Z-7010, Z-7007S)

The Trenz Electronic "ArduZynq" TE0723 Series is an Arduino shield compatible SoC module integrating a Xilinx Zynq-7007S(Xilinx Zynq-7010) Single-Core, 512 MByte DDR3L, and 16 MByte SPI Flash Memory for configuration and operation. A microSD connector provides additional data storage.

This device contains a single-core ARM Cortex-A9 processor and represents the lowest cost entry point to the scalable Zynq-7000 platform. Use it as a FPGA development platform, or run Linux on the Cortex-A9 core.

Key Features

Xilinx Zynq-7000(Z-7010, Z-7007S)
Form Factor: Arduino Shield
Single-Core ARM Cortex-A9 MPCore up to 766MHz
512 MByte DDR3L
16 MByte SPI Flash memory
12 MHz MEMS Oscillator low power consumption
Hi-Speed USB 2.0 ULPI Transceiver
23 FPGA I/O's
MicroSD Card socket
Micro USB OTG
RGB LED (PL I/O connected)
"Done" LED (inverted polarity)
On-board USB JTAG and UART
Linux-ready solution
CERN Open Hardware Licence 1.2

Scope of Delivery

1 x TE0723-03-11C64-A "ArduZynq" module with single-core processor Xilinx Zynq XC7Z007S-1CLG225C

產品編號：

TE0723-03-11C64-A：Z-7007S

TE0723-03-41C64-A：Z-7010

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: Products with Xilinx FPGA

TE0807｜UltraSoM+ Series

TE0807 "UltraSoM+" Series-Xilinx Zynq UltraScale+, DDR4, Flash, 20 High Speed Serial Transceivers（ZU4CG - ZU7CG, ZU4EG - ZU7EG, ZU4EV - ZU7EV）

The Trenz Electronic TE0807 "UltraSoM+" Series is a powerful MPSoC module integrating a Xilinx Zynq UltraScale+ ZU4CG - ZU7CG, ZU4EG - ZU7EG, ZU4EV - ZU7EV， 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

Key Features

Xilinx Zynq UltraScale+ Series
ZU7EV 900 Pin Packages
3 mm mounting holes for skyline heat spreader
Size: 52 x 76 mm
B2B Connectors: 4 x 160 pin
Rugged for shock and high vibration
4 GByte DDR4 SDRAM
128 MByte SPI Boot Flash (dual parallel)
User I/Os
- 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
- Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
- Transceiver clocks inputs and outputs
- PLL clock generator inputs and outputs
Graphic Processing Unit (GPU) + Video codec unit (VCU)
Si5345 - 10 output PLL
All power supplies on board, single 3.3V Power required
- 14 on-board DC/DC regulators and 13 LDOs
- LP, FP, PL separately controlled power domains
Support for all boot modes (except NAND)
Support for any combination of PS connected peripherals
Evenly spread supply pins for good signal integrity

Scope of Delivery

1 x TE0807-03-7DI21-A Trenz Electronic MPSoC Module with Xilinx Zynq UltraScale+ ZU07EV

產品編號：

TE0807-03-7DI21-A：Xilinx Zynq UltraScale+ ZU7EV-1I

TE0807-03-7AI21-A：Xilinx Zynq UltraScale+ ZU7CG-1I

TE0807-03-7DE21-A：Xilinx Zynq UltraScale+ ZU7EV-1E

TE0807-03-4AI21-A：Xilinx Zynq UltraScale+ ZU4CG-1I

TE0807-03-4BE21-A：Xilinx Zynq UltraScale+ ZU4EG-1E

TE0807-03-4BE81-A：Xilinx Zynq UltraScale+ ZU4EG-1E

TE0807-03-7DI21-AZ：AMD Zynq™ UltraScale+™ ZU7EV-1I

TE0807-03-7DE21-AZ：AMD Zynq™ UltraScale+™ ZU7EV-1E

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: Products with Xilinx FPGA

TEF0007｜FMC Card with DisplayPort input and output

TEF0007-FMC Card with DisplayPort input and output

The Trenz Electronic TEF0007 is a DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. SN65DP159 is used as DP Retimer and SN75DP130 as DP Redriver to connect sink and source to on board Kintex-7 FPGA.

Key Features

Xilinx Kintex-7 FPGA XC7K160T-2FBG676C
32 MByte QSPI Flash
Clock management
- 50 MHz oscillator
- Configurable PLL (SI5345) for MGT reference clocks (DP and FMC MGTs) and additional system clocks
Displayport
- Sink: up to 4 lanes over SN65DP159
- Source: up to 4 lanes over SN75DP130
- Important Note: Xilinx DP IP or other compatible third party IP is needed
FMC LPC compatible with one MGT RX/TX lane
- 34 differential IOs (68 single ended)
- 1 MGT on LPC or up to 4 MGT on HPC
- FPGA JTAG (optional over separate XSR connector possible)
- FMC EEPROM (not configured)

Scope of Delivery

1 x TEF0007-02A Trenz Electronic FMC card with pre-assembled heat sink
1 x Front panel with fixing material (screws, nuts and spacer sleeves)

	產品編號：TEF0007-02A
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: Products with Xilinx FPGA

TEC0089｜DesignWare ARC EM Software Development Platform

TEC0089-DesignWare ARC EM Software Development Platform

The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. The packages also contain the necessary software configuration information for the toolchain and embARC Open Software Platform.

The development platform is supported by Synopsys' MetaWare Development Tool Kit, which includes a compiler, debugger and libraries optimized for maximum performance with minimal code size. The embARC Open Software Platform (OSP), available online from embarc.org, gives developers online access to device drivers, FreeRTOS, middleware and examples that enables them to quickly start software development for their ARC-based embedded systems.

Each hardware configuration includes an ARC EM processor and subsystem with access to 16MB of PSRAM, 16MB of SPI Flash and a wide range of peripherals such Audio Line In/Out, UART, SPI, I2C, and ADC. A 9-D motion sensor enables fast development of IoT applications. Two digital MEMs microphones can also be used for the development of voice applications. The hardware is extensible using the popular Arduino® interface and extension is also possible with Digilent® Pmod™ Interfaces, mikroBUS™ headers and a 50-pin header. Debug and trace are handled with USB/JTAG interfaces and a NEXUS interface for ARC Real-Time Trace (RTT). The board includes a micro-SD card slot for loading application software.

Key Features

Xilinx Kintex-7 XC7K325T-2FBG676C
32 MByte Quad-SPI Flash memory (for configuration and operation)
USB-JTAG bridge FT2232H
FPGA configuration through:
- JTAG
- SPI Flash memory
SPI Flash configuration through:
- JTAG
- USB
Connectors
- Arduino compatible pin headers
- MicroBUS compatible pin headers
- 3x Pmod compatible pin headers
- 50 pin header 2.54mm (40 single-ended IO, 20 differential lanes, variable VCCIO)
- Mictor Debug connector
- 10 pin Debug connector 2mm
2 x 8 MByte PSRAM IS66WVC4M16EALL
32 MByte User Quad-SPI Flash memory
Micro SDcard Socket
3-axis gyroscope, 3-axis accelerometer, 3-axis magnetometer ICM-20948
Stereo Audio Codec MAX9880A
2 x PDM Microphones SPK0641HT4H-1
2 x 3.5mm RCA audio jacks (input/output)
100MHz User Clock Oscillator SiT8008
Status LEDs, Power LED
- 8 x User LEDs
- Reset Buttons
- User Button
- 2 x 4bit User DIP switches
12V Power Supply (separately included in the scope of delivery)

Scope of Delivery

The ARC EM Software Development hardware consists of:

1 x ARC EM SDP (hardware) board
1 x 12V Interchangeable Plug with four adapters and cable
4 x bolts and screws

	產品編號：TEC0089-02-D2C-1-D
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: Products with Xilinx FPGA

TE0729｜ Xilinx Zynq-7020,3 x Ethernet

TE0729－SoC Module with Xilinx Zynq-7020, 512 MByte DDR3L SDRAM, 3 x Ethernet

The Trenz Electronic TE0729 is an industrial-grade SoC module integrating a Xilinx Zynq-7020 with a Gigabit Ethernet transceiver, 2 x 100 Mbit Ethernet, 512 MByte DDR3L SDRAM, 32 MByte Flash memory for conﬁguration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of conﬁgurable I/O's is provided via rugged high-speed stacking strips.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

Key Features

Zynq XC7Z020-2CLG484I
Rugged for shock and high vibration
Equipped with sulfur resistant resistors
Evenly-spread supply pins for good signal integrity
3 mm mounting holes for Skyline heat spreader
2 x ARM Cortex-A9
1 x 10/100/1000 Mbps Ethernet transceiver PHY
2 x 10/100 Mbps Ethernet transceiver PHYs
3 x MAC-Address EEPROMs
512 MByte (16-bit) DDR3 SDRAM
32 MByte QSPI-Flash memory
8 GByte e.MMC memory
USB 2.0 high-speed ULPI transceiver
Plug-on module with 2 x 120-pin high-speed hermaphroditic strips
136 FPGA I/O's (58 LVDS pairs possible) and 6 PS MIO's available on board-to-board connectors
On-board high-efficiency DC-DC converters
- 4.0 A x 1.0V power rail
- 1.5 A x 1.5V power rail
- 1.5 A x 1.8V power rail
- 1.5 A x 2.5V power rail
System management
eFUSE bit-stream encryption
AES bit-stream encryption
Temperature compensated RTC (real-time clock)
User LED
size: 5.2 x 7.6 cm
Cooling Solution available

Scope of Delivery

1 x TE0729-02-62I63MA Trenz Electronic SoC module with Xilinx Zynq-7020

	產品編號：TE0729-02-62I63MA
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Products with Xilinx FPGA