Products with Xilinx FPGA

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Products with Xilinx FPGA

TEF1001｜ PCIe FMC Carrier ｜Xilinx Kintex-7 (160T/325T/410T)

TEF1001-PCIe FMC Carrier with Xilinx Kintex-7 160T, 4 Lane PCIe GEN2, DDR3 SODIMM ECC

The Trenz Electronic TEF1001-02-B2IX4-A is a PCIe FMC Carrier integrating a Xilinx Kintex-7 160T FPGA, 32 MByte SPI Flash, a 4 lane PCIe and a DDR3 SODIMM with ECC Socket.

It can also be equipped with Kintex-7 325T or 410T

Key Features

  • Xilinx Kintex-7 XC7K160T-2FFG676I
  • 1 x Vita 57.1 FMC HPC Slot
  • 4 lane PCIe Gen2

  • DDR3 SODIMM with ECC Socket (max. 8 GByte)

  • 32 MByte SPI Flash

  • Programmable clock generator Si5338

  • 200 MHz Low-Jitter LVDS oscillator

  • 12V power input protection circuit

  • 12V power input through PCIe connector edge available (with priority to the ATX input power connector)

  • FMC FAN on/off controlled by a pin-present on FMC

  • High performance DC-DC converters

Scope of Delivery

  • 1 x TEF1001-02-B2IX4-A Trenz Electronic PCIe FMC Carrier with Xilinx Kintex-7 160T FPGA

產品編號：

TEF1001-02-B2IX4-A：Xilinx Kintex-7 160T

TEF1001-02-D2CX4-A：Xilinx Kintex-7 325T

TEF1001-02-G2IX4-A：Xilinx Kintex-7 410T
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Products with Xilinx FPGA

TEC0330｜ Xilinx Virtex-7 FPGA, 8 Lane PCIe GEN2, SODIMM SDRAM

TEC0330－PCIe FMC Carrier with Xilinx Virtex-7 FPGA, 8 Lane PCIe GEN2, SODIMM SDRAM

The Trenz Electronic TEC0330 is a PCI Express form factor card (PCIe 2.0 or higher) integrating the Xilinx Virtex-7 XC7VX330T FPGA chip. This high-end FPGA card is designed for maximum system performance and intended for use in applications with high demands on system throughput. There is a SO-DIMM socket on the board for standard DDR3 SDRAM extension memory module.

The TEC0330 features HPC (High Pin Count) ANSI/VITA 57.1 compatible FMC interface connector for standard I/O Mezzanine modules. Other interface connectors found on-board include JTAG for accessing FPGA and on-board System Controller CPLD, and also connector with 5 high-speed I/O differential signaling pairs.

Key Features

  • Xilinx Virtex-7 FPGA module XC7VX330T-2FFG1157C (commercial temperature range)
  • PCI Express 2.0 x8 card with maximum throughput of 4 GB/s
  • FMC High Pin Count (HPC) connector
  • 8 FPGA MGT lanes available on PCIe interface
  • DDR3 SODIMM SDRAM socket
  • 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
    • FPGA
    • JTAG port (SPI indirect, bus width x4)
  • External clock input via SMA coaxial connector
  • 28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
  • FPGA configuration through:
    • JTAG connector
    • SPI Flash memory
  • Programmable quad clock generator
  • TI LMK04828B ultra low-noise JESD204B compliant clock jitter cleaner
  • On-board high-efficiency DC-DC converters
  • Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS pairs possible)
  • System management and power sequencing
  • AES bit-stream encryption
  • eFUSE bit-stream encryption

Scope of Delivery

  • 1 x TEC0330-05 Trenz Electronic PCIe FMC Carrier with Xilinx Virtex-7 330T FPGA

  產品編號：TEC0330-05
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Products with Xilinx FPGA

TE0802｜ Xilinx Zynq UltraScale+

TE0802－MPSoC Development Board with Xilinx Zynq UltraScale+

The Trenz Electronic TE0802 is a development board integrating a Xilinx Zynq UltraScale+. Other assembly options for the FPGA and the memory chips are available.

．Xilinx Zynq UltraScale+ ZU2,1 GB

．Xilinx Zynq UltraScale+ ZU1,1 GB

Key Features

  • Xilinx Zynq UltraScale+ XCZU2CG-1SBVA484E
  • Storage
    • 1 GByte LPDDR4
    • 32 MByte SPI Flash
    • MicroSD card
    • M2 PCIe SSD support
  • Display
    • DisplayPort
    • VGA
    • 4-digit 7-segment LED
    • 8 LEDs
  • Audio: 3.5 mm jack
  • 2 x Pmod connectors
  • Communication and Debug
    • USB 3.0 Host (type A connector)
    • USB JTAG/UART Micro-USB
    • Gigabit Ethernet RJ45
  • Input
    • 5 push buttons
    • 8 bit slide switches
    • Reset button
  • EEPROM
  • Power supply: 5V plug
  • Size: 100 mm × 100 mm. Please download the assembly diagram for exact numbers.

Scope of Delivery

  • 1 x TE0802-02-2AEV2-A MPSoC development board with Xilinx Zynq UltraScale+

  產品編號：

TE0802-02-2AEV2-A-TE0802｜ Xilinx Zynq UltraScale+ ZU2,1 GB

TE0802-02-1AEV2-A-TE0802｜ Xilinx Zynq UltraScale+ ZU1,1 GB
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Products with Xilinx FPGA

TEC0850｜ Xilinx Zynq UltraScale+ ZU15, 3U form factor

TEC0850－CompactPCI Serial Card with Xilinx Zynq UltraScale+ ZU15, 3U form factor

The Trenz Electronic TEC0850 board is a CompactPCI Serial card (3U form factor) integrating a Xilinx Zynq UltraScale+ MPSoC ZU15EG, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, 128 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors.

Key Features

  • Xilinx Zynq UltraScale+ XCZU15EG-1FFVB1156E
  • ZU15EG, 1156 Pin Packages
  • Dimensions: 3U, 8HP CompactPCI-Serial
  • Rugged for shock and high vibration.
  • Front side interface connectors
    • RJ-45 GbE Ethernet interface
    • Circular push/pull connector with 4x on-board 8bit DAC output
    • MicroSD Card connector
    • USB 2.0 and USB 3.0 to FIFO bridge connector
    • 4x status LEDs
  • 4 CompactPCI Serial connectors for backplane connection (3U form factor)
    • 24 GTH lanes
    • 4 PS GTR lanes
    • USB 2.0 interface
    • 64 Zynq PL HP I/O's
    • 8x PLL clock input
    • JTAG, I²C and 7 user I/O's to MAX10 FPGA
  • 8 GByte (up to 32 GByte possible configuration) DDR4 SODIMM, 64-bit width, support DDR4 SODIMM with ECC
  • 128 MByte dual parallel QSPI Flash (bootable), 512 MByte maximum
  • 26-pin header with 20 Zynq PL HD I/O's
  • 3-pin header with 2 MAX10 FPGA I/O's
  • System Controller (Altera MAX10 FPGA SoC)
    • Power Sequencing
    • System management and control for MPSoC and onboard peripherals
  • Si5345 programmable 10 output PLL clock generator
  • Si53340 Quad clock buffer
  • 1x user push button
  • Zynq MPSoC cooling FAN connector
  • On-board high-efficiency DC-DC converters
  • Evenly spread supply pins for good signal integrity.

Scope of Delivery

  • 1 x TEC0850-03-BBEX1-A Trenz Electronic CompactPCI Serial Card with Xilinx Zynq UltraScale+ ZU15EG

  產品編號：TEC0850-03-BBEX1-A
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Products with Xilinx FPGA

TE0807｜UltraSoM+ Series

TE0807 "UltraSoM+" Series-Xilinx Zynq UltraScale+, DDR4, Flash, 20 High Speed Serial Transceivers（ZU4CG - ZU7CG, ZU4EG - ZU7EG, ZU4EV - ZU7EV）

The Trenz Electronic TE0807 "UltraSoM+" Series is a powerful MPSoC module integrating a Xilinx Zynq UltraScale+ ZU4CG - ZU7CG, ZU4EG - ZU7EG, ZU4EV - ZU7EV， 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

 

Key Features

  • Xilinx Zynq UltraScale+ Series
  • ZU7EV 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND)
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Scope of Delivery

  • 1 x TE0807-03-7DI21-A Trenz Electronic MPSoC Module with Xilinx Zynq UltraScale+ ZU07EV

  產品編號：

TE0807-03-7DI21-A：Xilinx Zynq UltraScale+ ZU7EV-1I

TE0807-03-7AI21-A：Xilinx Zynq UltraScale+ ZU7CG-1I

TE0807-03-7DE21-A：Xilinx Zynq UltraScale+ ZU7EV-1E

TE0807-03-4AI21-A：Xilinx Zynq UltraScale+ ZU4CG-1I

TE0807-03-4BE21-A：Xilinx Zynq UltraScale+ ZU4EG-1E

TE0807-03-4BE81-A：Xilinx Zynq UltraScale+ ZU4EG-1E

TE0807-03-7DI21-AZ：AMD Zynq™ UltraScale+™ ZU7EV-1I

TE0807-03-7DE21-AZ：AMD Zynq™ UltraScale+™ ZU7EV-1E
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  1. TE0808 ｜UltraSoM+ Series
  2. TE0728｜Xilinx Automotive Zynq-7020
  3. TE0726 ZynqBerry｜Xilinx Z-7007S Single-Core
  4. TE0726 ZynqBerry｜Xilinx Zynq-7010