TE0808 "UltraSoM+" Series-Xilinx Zynq UltraScale+, DDR4, Flash, 20 High Speed Serial Transceivers(ZU6CG, ZU9CG, ZU6EG, ZU9EG, ZU15EG)

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

Key Features

• Xilinx Zynq UltraSoM+ Series
• ZU9EG 900 Pin Packages
• 3 mm mounting holes for skyline heat spreader
• Size: 52 x 76 mm
• B2B Connectors: 4 x 160 pin
• Rugged for shock and high vibration
• 4 GByte DDR4 SDRAM, 64-Bit width
• 128 MByte SPI Boot Flash (dual parallel)
• User I/Os
  • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
  • Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
  • Transceiver clocks inputs and outputs
  • PLL clock generator inputs and outputs
• Si5345 - 10 output PLL
• All power supplies on board, single 3.3V Power required
  • 14 on-board DC/DC regulators and 13 LDOs
  • LP, FP, PL separately controlled power domains
• Support for all boot modes (except NAND) and scenarios
• Support for any combination of PS connected peripherals
• Evenly spread supply pins for good signal integrity

Scope of Delivery

• 1 x TE0808-05-9BE21-L Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU9EG, low profile

產品編號： TE0808-05-9BE21-L：Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GB DDR4, LP TE0808-05-9BE21-LZ：Zynq UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU9EG-1E, 4 GB DDR4, LP TE0808-05-6BE21-L：Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4, LP TE0808-05-6BE21-A：Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4 TE0808-05-9BE21-A：Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 TE0808-05-9GI21-A：Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GB DDR4 TE0808-05-BBE21-A：Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GB DDR4 TE0808-05-BBE21-AZ：AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GB DDR4

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